Electronics Forum | Mon Jan 14 16:25:35 EST 2002 | bentzen
Hi Yannick A lot of things can cause solder balls and spattering. Such as a to steep preheat profile and to much solder present. Check out more info on: http://www.smtinfocus.com/smt_failure_list.html
Electronics Forum | Wed Jan 14 06:42:38 EST 2004 | tommy
We see spattered(spitting of flux or solder to nearby area) solder/flux on gold fingers.We view the gold fingers area under 30x before reflow and it is cleaned but after reflow we see flux droplets or solder on gold fingers. We tried to changed a new
Electronics Forum | Mon Feb 07 09:03:15 EST 2005 | Chunks
This paste does tend to solder ball - but short of changing paste you can change your stencil to accommodate it. First, why 10 mils? Seems very thick. What size parts are your working with? Typically you can �homeplate� the R�s and C�s and this
Electronics Forum | Sun May 16 03:38:49 EDT 1999 | Zambri
I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. I don't fa
Electronics Forum | Wed May 19 11:07:25 EDT 1999 | Glenn Robertson
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea
Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Mon Mar 26 08:52:19 EDT 2007 | realchunks
Hi J, Yes, we do too. Funny thing is I was just looking at this last Friday. We call it sharing the bottom of the barrel. Typically it's just Process Engineers stuck down here, but from time to time, Maintenance gets stuck down here too. When in
Electronics Forum | Thu May 20 11:51:37 EDT 1999 | KT
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
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