Electronics Forum | Thu May 20 11:51:37 EDT 1999 | KT
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Wed Jan 14 08:28:46 EST 2004 | davef
Search the fine SMTnet Archives for background on solder on gold fingers. As we recall: * Paste selection * Proper reflow recipe tuning ... are important.
Electronics Forum | Mon Nov 19 14:10:13 EST 2007 | realchunks
Hi Taint, Both machines work OK. The big thing you may over look is pre-heat. Things like flux spatter/boil tend to come into play if you don't pre-heat. Change over, ease of programming, and service are also things to think of.
Electronics Forum | Thu Oct 16 12:12:16 EDT 2008 | slthomas
"We don't associate solder balls with no-clean flux and humidity." I'll let the former speak for itself, but on the latter, not even spatters?
Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway
What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi
Electronics Forum | Thu Jun 24 14:34:13 EDT 2004 | tjensen
There are many factors that can lead to solder balls. Since you have just recently seen this start to occur, it is obvious something has changed in the product or your process. Since we don't have a lot of details about your process, I would sugges
Electronics Forum | Wed Nov 16 09:22:24 EST 2005 | chunks
These are all good questions. Dip fluxing is fine. Make sure you let all the remaining flux drip off the board. Letting it drip into the pot will cause a lot of spattering of hot solder � be careful. Dipping the board slowly into the pot should
Electronics Forum | Wed Aug 23 15:19:11 EDT 2000 | Dr. Ning-Cheng Lee
From solder material point of view, a solder paste with slow coalescence rate, or slow wetting rate, will be most desirable. Processwise, allowing the paste to stay at soaking zone for longer time will dry out the volatiles, and reduce the chance of
Electronics Forum | Thu Jun 06 12:24:30 EDT 2002 | cyber_wolf
Brad your theory sounds good, but I have seen this happen at very low ramp rates .5 deg to 1.5 deg C rate of rise a sec. with the same soak duration you mentioned. If flux spattering is the case and you are using Alpha paste..switch to Indium and yo
Electronics Forum | Tue Jan 26 19:43:02 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
