Electronics Forum | Thu Jul 20 15:47:13 EDT 2000 | Bob Willis
Based on what you have said so far it would be worth trying extra pads and as you may know the drainage pads should be a minimum of three times the length of the pads before them to be effective. Also take some parts stick them to a glass plate and r
Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean
Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde
Electronics Forum | Wed Aug 23 15:10:24 EDT 2000 | Dr. Ning-Cheng Lee
Fillet lifting is a phenomenon mostly observed at wave soldering. It is caused by mismatch in thermal expansion coefficient (TCE) between solder and parts, and aggravated by the pasty range of solder alloys. Upon cooling, the mismatch in TCE will cau
Electronics Forum | Tue May 08 22:34:53 EDT 2007 | davef
Do you mean "how to solve or reduce this defect at wave soldering process" while continuing to use-up my SACX solder? If so, try: * Smaller solder volumes lower shrinkage hole / hot tears [Higher hole diameter versus pin diameter helps in reducing v
Electronics Forum | Wed Mar 22 01:24:54 EST 2006 | Joseph
Dear all, Referring technical report from Vitronics Soltec, "Pad lifting, fillet lifting and fillet tearing issues in LF soldering". The use of LF solder alloys today has brought about a recurrence of this crack formation, called fillet tearing. The
Electronics Forum | Fri Aug 08 07:15:49 EDT 2008 | davef
Hot tear occurs at the surface of the solder connection. The surface will look like someone tore the surface apart. So, it is a crack or fracture formed prior to metal solidification.
Electronics Forum | Tue May 08 10:31:04 EDT 2007 | Yankee
Hi all, I think Hot Tear or Shrink Hole defect is common in LEAD FREE wave soldering, especially those solder is from SAC type. As far as I know, it is related to cooling rate. Is there anyone know how to solve or reduce this defect at wave solder
Electronics Forum | Wed Aug 06 08:09:57 EDT 2008 | davef
We agree that the squigglie part of the section of the BGA ball looks like something other than 'hot tear.' We'd guess that it is an inclusion, but it could be a sectioning defect, as you say. We agree that the majority of occurances of hot tear are
Electronics Forum | Wed May 09 11:01:27 EDT 2007 | callckq
Yes, continue to use SAC solder. However, as far as I know, the problem become more severe when cooling rate is increased.
Electronics Forum | Tue Nov 30 11:51:54 EST 1999 | Wolfgang Busko
Hi all, a lifted lead (FP 0,5mm pitch) with a wire soldered to it needs proper protection against tear off. What kind of coating is appropriate, should be dispensable and fast drying. Thanks in advance Wolfgang
