Electronics Forum | Thu Oct 08 03:33:50 EDT 1998 | Thomas Blesinger
| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain
Electronics Forum | Fri Oct 09 04:06:27 EDT 1998 | Thomas Blesinger
| Thomas: What shape and size are the aperatures to print paste for the connector? Can you do something like ... | | 1 Using a (250m + 120m)/2 or so thick foil? | 2 Pinching the non-connector pads? | 3 Increasing the aperatures for the connecto
Electronics Forum | Tue Jun 23 11:27:37 EDT 1998 | Russ M
Has anyone seen/used these yet? They seem to have lower coefficient of friction for release of paste and less wear and tear as well as conforming to the board better (plastic has better memory than stainless). Also there is no mesh so a larger image
Electronics Forum | Tue Jun 23 19:01:21 EDT 1998 | EC
| Has anyone seen/used these yet? They seem to have lower coefficient of friction for release of paste and less wear and tear as well as conforming to the board better (plastic has better memory than stainless). Also there is no mesh so a larger ima
Electronics Forum | Thu Oct 08 22:20:44 EDT 1998 | Dave F
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Fri Oct 09 04:08:45 EDT 1998 | Thomas Blesinger
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Thu Mar 23 10:35:55 EST 2006 | Wave Master Larry
WEll Im hearing all this talk about leadfree nonsense from the engineering dept at my place of employment.Let me tell you Ive been looking at this stuff for 12 yrs and i think tearing of the filet is a normal part of the solder joint kindof like dros
Electronics Forum | Mon Oct 21 19:17:23 EDT 2013 | hegemon
The first picture shows an issue. Note that the vias adjacent to the interior rows are filled with solder. At the outside rows this is not evident. What you might have are interior spheres that are smaller in volume than the rows on the outide, si
Electronics Forum | Sun Sep 21 15:48:48 EDT 2014 | gascon5383
Our company has a process standard that requires a double person check at the beginning of every run (size of run is irrelevent, whether 20 panels or 500 panels). Every changeover that occurs a first piece inspection is made before reflow. If all is
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