Electronics Forum | Wed Jun 27 21:33:09 EDT 2001 | davef
There was a similar thread last week on SMTnet. Maybe the poster of that thread can help. Not everyone responds on-line. Check the SMTnet Archives for generalities and platitudes about PIH, although there may be some good links. Baring the obviou
Electronics Forum | Thu Jun 25 09:13:25 EDT 1998 | Brad Stapley
| Has anyone seen/used these yet? They seem to have lower coefficient of friction for release of paste and less wear and tear as well as conforming to the board better (plastic has better memory than stainless). Also there is no mesh so a larger ima
Electronics Forum | Wed Nov 06 12:56:10 EST 2002 | slthomas
What I'm seeing is an occasional pattern of tear drop shaped features in a sea of nice shiny solder. The little islands don't really have any relief.....it's more of a surface finish feature than a 3-dimensional feature. The wetting angles are good,
Electronics Forum | Wed Jun 06 15:59:25 EDT 2007 | chrisawallace
WML, I won't dispute math but I will definitely point out either bad math or a missed target. In your example, you are comparing "Energy used to heat the solder and keep it warm" versus "Energy used to keep the solder warm" and fully discount the fa
Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef
No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste
Electronics Forum | Thu Oct 08 22:32:58 EDT 1998 | Dave F
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Tue Sep 15 12:27:59 EDT 2015 | sumote
The key to longevity in any automated soldering machine is in the preventative maintenance. If the machine has had regular maintenance preformed on it, your job will be that much easier. The 1st thing I would do is to either throw out the solder t
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Sun Jan 14 12:42:35 EST 2007 | SMTRework
I think the main cause of this condition is #3 because both #1 and #2 never change from board to board, these are identical boards with identical BGA revisions. These BGA's (as stated before) are about 3 years old.. I don't believe they are lead free
Electronics Forum | Mon Feb 22 13:39:22 EST 1999 | Justin Medernach
| Can anybody give me the Pros and Cons of of using Cartridges over jars and/or vice-versa. Also, if using cartridges, what is the best way to keep the paste from seperating, short of buying a mixer that cost over $5000.00 | Thanks, | Bill | Bill,
