Electronics Forum | Thu Mar 04 07:35:38 EST 2010 | rajeshwara
Plz tell me Stencil Thickness ? Solder Paste ? Mesh Size ? Partcle size/type? Viscosity?
Electronics Forum | Mon Aug 22 10:33:23 EDT 2005 | davef
Q1. What is recommended viscosity standard? A1: There is no standard. ASTM D4040-05 "Standard Test Method for Rheological Properties of Paste Printing and Vehicles by the Falling-Rod Viscometer" is a test method that might work. For more, look her
Electronics Forum | Tue Jan 25 20:19:24 EST 2000 | Charley Qin
Hi, Mark Acturally, solder paste viscosity reading is very closely related to eviroment such as temperature and relative humidity. So I'm afraid it is hard to tell the diffrence between measurements without enviroment control. Regarding to LSM, we'v
Electronics Forum | Tue Jun 23 05:52:15 EDT 2020 | ameenullakhan
Hi dave, Thanks for the input. your valuable feedback always help. which method is better Spindle or T-bar. IPC TM 650 have are considered as standard methods. 1. T bar 2. Spindle. since we have never used it. we are bit confused. Which would be
Electronics Forum | Mon Feb 07 12:47:18 EST 2005 | Indy
1. use 6-7mils stencil. 2. reduce aperture opening to 60-70% of pad size. 3. check viscosity of solder paste. According to that you might want to alter your print speed and pressure. Cheers Indy
Electronics Forum | Mon Jul 30 21:12:32 EDT 2001 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, a 6 thou stencil should be OK, providing you don�t violate the area and aspect ratios in the fi
Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F
Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�
Electronics Forum | Wed Feb 25 21:37:12 EST 2015 | dinhhuunam
Hi Bartel , 1.1 Profile Solution to Cold Soldering Cause for Cold soldering The peak temp of reflow is too low. The preheating temp is too high and it takes too long Solution Lower the preheating temp and increase the peak temp in the reflow zone
Electronics Forum | Thu Apr 23 21:07:09 EDT 2009 | luismolinero
Emilio: Several factors you need to take into account and your process parameters will depend on: Solder Alloy, Is there any Fine Pitch?; BGA?; Smaller chip size?. Tipically you should go for controls in: Solder Temperature and viscosity; blade and s
Electronics Forum | Thu Jun 24 14:34:13 EDT 2004 | tjensen
There are many factors that can lead to solder balls. Since you have just recently seen this start to occur, it is obvious something has changed in the product or your process. Since we don't have a lot of details about your process, I would sugges
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