Electronics Forum | Thu Jun 24 14:34:13 EDT 2004 | tjensen
There are many factors that can lead to solder balls. Since you have just recently seen this start to occur, it is obvious something has changed in the product or your process. Since we don't have a lot of details about your process, I would sugges
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Tue Aug 01 08:52:53 EDT 2006 | davef
We never changed any thing after moving to imm silver. "Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release bette
Electronics Forum | Sat Jul 03 02:16:56 EDT 2004 | yukim
What's the difference between static and dynamic viscosities? Is there any relationship between Brookfield and Malcom Viscosity Values?
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
Electronics Forum | Sun Sep 27 22:39:55 EDT 2009 | rajeshwara
The same issue i faced 2 yrs before , i sugest 1. Use stencil of 4 mils ( Take care of Aspect Ratio and Area Ratio ). 2. Use Solder Paste of Type 4.5 and Viscosity in between 1100 to 1300. ( Try Solder Paste of Cookson or Alpha metals : OM338 T45-L
Electronics Forum | Wed Feb 14 10:10:55 EST 2007 | rob_thomas
The challenge regarding the stencil was mostly due to the actual board layout and nothing having to do with the voids in the solder. It was my first encounter with 0.5 mm pitch on BGA and dealing with a LF solder paste with higher viscosity than tha
Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG
Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc
Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Mon May 21 09:06:33 EDT 2007 | davef
Pat: Very descriptive SUBJECT choice. Surface tension: * Soldering and Surface Tension; Champion, JA; Physics Education, V 16, No 2, 1981, pp 98-100(3) Institute of Physics [We have not looked at this, so we cannot comment, but it seems like an appr
