Electronics Forum | Thu Oct 07 21:07:45 EDT 1999 | Bix
| | Make sure you check the MSDS for the new paste. If you have more than one production line, I'd suggest a gradual changeover. One selling point for management would be the free training Multicore will give you for the switch. If you haven't alr
Electronics Forum | Tue Oct 27 09:05:29 EST 1998 | Mike Scott
Has anyone found a way to control viscosity of no-clean paste?
Electronics Forum | Mon Jun 27 09:35:24 EDT 2005 | russ
What is the viscosity of your lead free paste vs. your lead paste?
Electronics Forum | Wed Feb 15 10:59:58 EST 2023 | wippsen
the viscosity of the paste is too high, printing parameter is not the problem. did you use old solder?
Electronics Forum | Wed Mar 14 09:07:34 EST 2001 | blnorman
We just ran a study to try to determine this. We exposed the paste to 85% humidity to simulate worst case manufacturing. At various times we removed the paste from the chamber and tested it for tack, solder balling, wetting (copper coupon), and vis
Electronics Forum | Tue Apr 06 20:28:41 EDT 1999 | Scott McKee
| I need help in finding solder paste measuring equipment. | Height, length, width, area, volume after printing (off line): 1. Cyberoptics:1-800-745-6315 www.cyberoptics.com 2. Manix Manufacturing 1-215-953-9797 3. Theta Group 1-205-650-0535 4.
Electronics Forum | Fri Nov 05 21:41:46 EST 1999 | chartrain
Temperature vs time is what soldering is all about. The faster you run your conveyor, the more heat will have to come from the pot for a given assembly. Example: You heat the board to 200F top side through the preheaters. Eutectic 63/37 melts at 361.
Electronics Forum | Mon May 17 15:14:12 EDT 2004 | solderpro
Agree with Joe 100%, we recently brought one in from Malcolm for trial, this company had not practiced viscosity reading or anything in the process, the trail run was a great improvement in print, consistancy, deposition and formation of the solder b
Electronics Forum | Wed Feb 23 00:45:49 EST 2011 | tsvetan
Does someone with technical knowledge knows what exactly happend with the solder paste after the shelf life pass? What we have seen is sometimes flux separation which disapear after a good mix, and change of viscosity i.e. drying. The tin, silver and
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
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