Electronics Forum | Tue Oct 24 12:20:35 EDT 2000 | JohnW
Adam, Did some work on this a bit back via some good old Taguchi DOE and like Dave(the guru)F say's your component terminations is a big factor but I also foundthat the amount of flux you put on as well as the preheat's has an effect, generally we f
Electronics Forum | Thu Apr 29 10:02:07 EDT 1999 | Chrys Shea
| Anyone using hot air nife for wave soldering process. | Does it work? | Does it really eliminate solder bridging and does it create any other problems? | | any feed back will be much appriciated. | | Thanks | | Tony A | | Tony, The hot knif
Electronics Forum | Mon Jul 26 11:01:35 EDT 1999 | Kevin Hussey
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | I ha
Electronics Forum | Fri Feb 21 19:49:36 EST 2003 | MA/NY DDave
Hi Good Luck Neil, When I first saw this process described, what you are experiencing was my first visual thoughts. Partial filling as well as huge solder voids inside of the joints. I figured for low reliability product or short life maybe this t
Electronics Forum | Thu Jun 24 02:31:24 EDT 2004 | yukim
Currently we are having a lot of solder balls, after a few hours of continous production. This is how we work: load new solder paste at the beginning of the shift, less than 500grms. Then, the operator loads new solder paste periodically, every 3 to
Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX
Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the
Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX
Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the
Electronics Forum | Wed Aug 23 17:06:40 EDT 2000 | Dr. Ning-Cheng Lee
For 20 mil pitch pads, the volume control is more critical in terms of bridging concern. In general, solder paste for dispensing is more prone to slumping due to low metal load and low viscosity. If the volume dispensed is on the high end, or if the
Electronics Forum | Sat Jan 24 00:13:57 EST 1998 | Scott
| What is the lifetime for a typical solder paste ? | How long can boards be stacked waiting before the paste goes off ? Lifetime and tack time depends on: - Manufacturer - Flux/mixture - Environmental conditions Typical lifetime is dependent on stor
Electronics Forum | Sat May 12 08:58:23 EDT 2012 | davef
On mixing paste: There could be a lot of hand wringing about the need to minimize solvent evaporation, flux separation, and chemical activity. [True alarmists will throw in oxidation of the alloy.] But I think the real concern is a change in viscosit
.gif)
