Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker
First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Fri Jul 09 17:50:20 EDT 1999 | Jim Blankenhorn
Hi Carol- What you are asking for can be done. Variables you must account for include the paste viscosity, dispensing head speed, dispenser height relative to board surface, and needle size. You can use most any semi-automated system such as Camalo
Electronics Forum | Thu Nov 21 02:43:07 EST 2002 | jate
Hi, Jar's quality is easier to measure. If you want to know paste viscosity etc. it's easier if you use jar. I have bad experiences about cartridges. I used cartridges for a short time but I change it back to jar because flux separated too easily in
Electronics Forum | Mon Oct 20 11:48:34 EDT 2003 | blnorman
Who said there was NO evaluation? The paste we chose was evaluated based on a 20 point test score as well as material compatibility. Once we introduced it to manufacturing each line had problems. For one manufacturing treated it as a drop in repla
Electronics Forum | Wed May 12 08:35:20 EDT 2004 | solderpro
yes this paste is a pain in the paste.... there are very few reasons for solderballs, component to pad ratio and placement.... solder paste control, using a mixer, not hand mixing, checking viscosity and temp..... or simply and bad profile and your
Electronics Forum | Wed May 12 12:22:38 EDT 2004 | solderpro
I agree with the guy about cars, boats, ect... ok, I like as some have said without a doubt, DEK top of the line.... pick and place, love siemens but software is not user friendly, myself, JUKI all the way, great equipment, great software, that mean
Electronics Forum | Sat Aug 21 02:27:21 EDT 2010 | isd_jwendell
The paste you dispense will not solder the same as the one you use with a stencil. The paste for the stencil will have a higher metal content. I was not working with dispensing as small as you are, but after evaluating the cost of the stencil vs. lon
Electronics Forum | Tue Nov 01 09:16:03 EDT 2011 | austinpeterman
Hello, Looking for a solution to silicon conformal coating wicking up into connectors. We build IPC-A-610 class 2. We are using a PVA 650 with Dow Corning 1-2577 conformal coating. We have solder joints that must be coated 1.25mm from the connecto
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