Electronics Forum | Wed Apr 15 14:57:20 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 14:53:06 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Mon Apr 13 08:47:09 EDT 1998 | Bob Silveri
| | | | | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Fri Dec 01 12:02:15 EST 2000 | blnorman
I have over 10 years experience in aerospace materials, part of which was involved with vacuum casting inert propellant formulations. These propellants are in the range of 80 - 90% solids loaded with viscosities of 15 kP. I'm not sure where I could
Electronics Forum | Thu Jul 26 13:17:45 EDT 2001 | Hussman
Most solder paste manufacturers will take a reasonable amount of paste back, just so they won't loose your business due to bad paste. But if you're asking to ask to ask - separated paste from flux is not a bad thing if the jar was never opened. Pas
Electronics Forum | Thu Sep 09 21:50:53 EDT 1999 | kyung sam park
2 will have enormous impact on every other process. | | thank in advance. scott. I appreciate your sincere answer. would tell me the hint about printer if i's possible To tune our smt process we have to know what is the major X's for defect.
Electronics Forum | Thu Sep 09 22:18:13 EDT 1999 | Dave F
2 will have enormous impact on every other process. | | | thank in advance. | | | scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X
Electronics Forum | Wed Jan 28 19:39:08 EST 1998 | Steve Gregory
| | What is the lifetime for a typical solder paste ? | | How long can boards be stacked waiting before the paste goes off ? | Lifetime and tack time depends on: | - Manufacturer | - Flux/mixture | - Environmental conditions | Typical lifetime is dep
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
