Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter
> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.
Electronics Forum | Fri May 15 10:51:12 EDT 1998 | Justin Medernach
| We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | We have no c
Electronics Forum | Fri May 15 12:01:34 EDT 1998 | Justin
| | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | We have
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Wed Mar 27 21:20:30 EST 2002 | davef
There is two major BGA coating camps. * Camp #1: "We require the coating to be under low stand-off devices but with no filleting. So we apply a thinned dip coat first, and then top-off with a proper spray coat" * Camp #2: "We want no coating under th
Electronics Forum | Tue Jul 03 01:54:42 EDT 2018 | rdhiman1
Reaching out to all conformal coating experts, please help! While setting up conformal coating using the automated atomized spray, we observing issues associated with conformal coating wetting on the following regions: 1) Component edges 2) Metalli
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Fri Jun 05 07:21:17 EDT 1998 | Earl Moon
| I am currently reading as many articals as I can to familiaize myself with Surface Mount Technology. My company is planning to install a SM production line by the end of the year. | Here is one of my questions. | I have read that one of the specifi
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