Industry News | 2008-06-11 18:26:39.0
FINE LINE STENCIL announces Slic Blade™, its newest line of squeegee blades, and a SMT VISION Award winning product.
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
Industry News | 2020-06-11 05:50:07.0
Seika Machinery, Inc. announces a special summer sale on select products. Significant savings are available for McDry cabinets, Sawa stencil cleaners, Sayaka PCB routers, Malcom viscometers, paste mixers and profiler systems while stock lasts.
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Industry News | 2008-04-08 22:33:32.0
COLORADO SPRINGS, CO � April 2, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded a SMT VISION Award in the category of Assembly Tools for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, April 2, 2008 ceremony that took place in Las Vegas during APEX 2008.
Industry News | 2008-07-19 14:36:57.0
COLORADO SPRINGS, CO � July 16, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded an Advanced Packaging Award in the category of Handling Equipment/Fixtures for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, July 16, 2008 ceremony that took place at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2018-02-27 20:43:05.0
Juki Automation Systems(JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, announces that it has been awarded a 2018 NPI Award in the category of Screen / Stencil Printing for its new G-Titan Screen Printer. The award was presented to the company during a Tuesday, Feb. 27, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2015-10-22 16:43:19.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
Industry News | 2016-05-24 20:29:22.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
