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Two Indium Corporation Experts to Present “Best Papers” at SMTA South China Technology Conference 2018

Industry News | 2018-08-16 20:05:44.0

Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China.  Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.

Surface Mount Technology Association (SMTA)

SMTA International 2011 Best Papers Announced

Industry News | 2012-02-07 01:05:27.0

The SMTA is pleased to announce the Best Papers from SMTA International 2011. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 22nd

Industry News | 2019-07-09 19:58:49.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,Laurel, MD 20723, on Thursday, August 22nd.

Surface Mount Technology Association (SMTA)

Cleaning, Military and Printed Electronics, Solderability and Reliability Highlight IPC APEX EXPO Technical Conference 35 technical sessions with nearly 100 research papers

Industry News | 2012-12-14 06:50:53.0

e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.

Association Connecting Electronics Industries (IPC)

IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

Industry News | 2015-09-30 10:08:42.0

IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.

Association Connecting Electronics Industries (IPC)

MPM Introduces Next Generation Momentum II Printer

Industry News | 2019-11-05 12:11:26.0

ITW EAE is introducing the MPM® Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.

ITW EAE

MPM Completes Next Generation Momentum II Printer Line with Introduction of BTB and 100 Models

Industry News | 2020-04-14 19:07:23.0

ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.

ITW EAE

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

QFN Rework Using Polyimide Stencil

QFN Rework Using Polyimide Stencil

Videos

Video demonstrates easy to use leadless device rework process using polyimide stencil. This is the process described in IPC 7711/21 Procedure 5.8.1.1. and 5.8.1.2. For More Information Visit Our Site: http://www.solder.net/services/qfn-rework For

BEST Inc.

Micro-Sectioning of PCBs for Failure Analysis

Technical Library | 2010-01-13 12:34:10.0

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.

BEST Inc.


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