Electronics Forum | Wed Jul 06 15:26:12 EDT 2022 | glasscake
No experience with low temp solders for PIHR but we do use standard lead free 245-255 peak profiles on high temp connectors frequently. Honestly the added cost of the high temp connector pays for itself in labor. I almost always use oversized apertu
Electronics Forum | Wed Jul 06 15:29:01 EDT 2022 | glasscake
Also I should mention, I've ditched the formulas for getting the "optimal" solder amount after being bit by them once. Now I just design a PCB with 4-10 spots for the connector then order a stencil with a range of aperture sizes. Figure out what give
Electronics Forum | Mon Jun 12 10:34:06 EDT 2006 | cuculi54986@yahoo.com
My brother-in-law is a DDS and I trust him. We had some problems with solder voids in the past, and he was invaluable. He'd drill them out and fill them with SAC3240X+.
Electronics Forum | Wed Jun 29 12:31:32 EDT 2022 | proceng1
I don't know about that paste, but I can give my experience trying intrusive reflow (pin in paste). Using standard Lead-Free paste, we often had issues. It seems that many ROHS parts can't actually handle reflow ROHS temperatures. So the fact that
Electronics Forum | Fri May 15 18:18:51 EDT 1998 | Earl Moon
| Help! | We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The
Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval
I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
Electronics Forum | Mon Oct 15 14:36:03 EDT 2018 | davef
The methods of verifying PTH hole-fill. 1 Visual inspection 2 x-ray inspection works very well for inspecting such a connector for voiding and hole fill. View the connector off-vertical, at between 30 and 45 degrees. As always, the solder connect
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