Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2024-04-06 00:43:25.0
Live demos at IPC APEX Expo 2024 – Booth 1504 – April 9-11, 2024, Anaheim, CA GRAND JUNCTION, CO USA -- April 2024 -- GPD Global – manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix, and R&D production – will exhibit in Booth 1504 at IPC APEX EXPO 2024 on April 9-11 in the Anaheim Convention Center, CA.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Tue Apr 20 18:30:00 UTC 2021 - Tue Apr 20 18:30:00 UTC 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Orlando, Florida USA | Production
Position Summary: Build through-hole (THT) and surface mount (SMT) printed circuit board assemblies, placing components on boards per controlled parts lists, drawing documentation and quality workmanship guidelines. Position reports to: Group Lea
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify
Career Center | Noida, U.P India | Engineering,Purchasing,Sales/Marketing
I am Pushkar Agarwal from India having two years of experince in Marketing & sales of Robotic Liquid dispensing Systems, Soldering Machines & Products, Electronic Components.
Career Center | Cedar Park, Texas USA | Production,Research and Development
I have been trained and certified in the following: � Fuji CP � Fuji IP � Universal GSM � Universal GDM � MPM � IPC-610B � Solder Level I � Solder Level II � Defect identification � Component ID � Microscope � PCB inspection � Five-S �
Featured Article Return to Front Page REFLOW SOLDERING
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-to-present-at-smta-guadalajara-expo-and-tech-forum
. Compact peripheral component interface connectors especially present solderability issues due to their beryllium copper termination pins
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
—it means carefully considering many intricate factors like signal integrity, power distribution, and thermal management. Ultimately, the layout design will include information like how to route the traces, the component footprints, placements of layers, and vias
