Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | ESD Control Supplies
High humidity is known to cause problems with electronic parts and components, however compliance with RoHS standards has raised awareness of moisture issues and seen a huge increase in the use of moisture barrier bags. Barrier Bags Use of unleaded
Electronics Forum | Mon Feb 11 20:07:46 EST 2002 | caldon
Stephano- There is a Chemical process to revert the contamination back to its original form. The EMPF Developed it back a few years ago in conjunction with Rockwell and some others. Please contact ACI at 610-362-1200 and ask for Dr. Greg Parks. This
Electronics Forum | Mon Feb 11 13:28:36 EST 2002 | stepheno
We have some BGA's that don't solder very well. They weren't properly stored in regards to moisture protection. The balls look dull and rough. After reflow there seemed to be a diffinate line between the balls and the solder on the PCB's. I think
Used SMT Equipment | Soldering - Reflow
TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con
Used SMT Equipment | General Purpose Equipment
FEATHERS The solder paste miser efficiently and evenly mixes the solder paste to a liquid state. It helps to achieve better results of stencil printing and reflowing processes. The use of the mixer also reduces the chances of absorbing air moistur
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Parts & Supplies | Soldering - Wave
Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji
Technical Library | 2019-04-07 22:47:46.0
How to protect your PCB from moisture related damage? J-STD-033 put forward stricter regulation on the MSD exposure environment,when the exposure time exceed the tolerated,the moisture will penetrate into electronics,Moreover, the newest RoHS regulation will rise soldering temperature,the sudden high temperature will lead to expansion and cracking on electronic components. In order to decrease the moisture defect on PCB for the manufacturers in China,Climatest Symor® begin to concentrated on electronic dry cabinet R&D since early 1990s,we specialize in handling temperature and humidity for 20 years,and we provide best solution for PCB storage.
Technical Library | 2024-02-05 17:51:01.0
Objective: Drying = reducing the humidity in PCB before soldering Preventing delamination caused by thermal stress after moisture absorption Methods: Drying in convection and/ or vacuum oven Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)
D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric environment. Model:JYPJ-1000 JYPJ-1000 system accurately meters, m
D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric environment. Model:JYPJ-1000 JYPJ-1000 system accurately meters, m
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
Heller Industries Inc. | https://hellerindustries.com/delamination/
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
