Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer
Avcom is a complete electronic service manufacturer that offers the flexibility to choose the services you require. We can manage and produce your entire project or perform a single service.FREE quote
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Tue Sep 07 06:14:27 EDT 1999 | Earl Moon
| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine
Used SMT Equipment | AOI / Automated Optical Inspection
MIRTEC MV-7U AOI, MV 7 Series In-Line AOI Machine • In Line Type Vision Inspector for Large Boards• Windows 7 Intel Core2 Duo PC• Five Camera In-Line AOI System• 10 MP cameras with ISIS Vision• 13.4 micron um/pixel Telecentric Compound Lenses• Board
Used SMT Equipment | AOI / Automated Optical Inspection
MIRTEC MV-7U AOI, MV 7 Series In-Line AOI Machine • In Line Type Vision Inspector for Large Boards• Windows 7 Intel Core2 Duo PC• Five Camera In-Line AOI System• 10 MP cameras with ISIS Vision• 13.4 micron um/pixel Telecentric Compound Lenses• Boar
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Pick and Place/Feeders
more than we can offer contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 motor JUKI KE730 Z Axis Motor L404-151EL8 JUKI KE730 T Axis Motor L402-021EL0 23W 24V 1.9A JUKI KE750 X Axis Motor TS4513N1820E200 E9611721000 JUKI K
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2007-02-01 09:36:26.0
Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment.
Good Quality Hot Air Lead Free Led Reflow Oven in SMT Line ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | pro
The Access Control Face Recognition system is a very widely used product. It is currently not only used in residential buildings and office buildings, but also in many scenarios. For example, corporate attendance: Some companies also use the acces
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Fri Apr 16 00:00:00 EDT 2021 - Fri Apr 16 00:00:00 EDT 2021 | ,
Auburn University Student Chapter Event: Get Hired in Electronics Industry
Events Calendar | Mon Jan 14 00:00:00 EST 2019 - Mon Jan 14 00:00:00 EST 2019 | ,
Webinar: Crimp Inspection, Quality Control in the Real World of Manufacture
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Huntington Beach, California USA | Engineering
Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities
Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support
9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
| https://www.eptac.com/class/ipc-a-600-specialist
IPC-A-600 Specialist Course | Online, In-Person & Challenge Test Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/applications/test-and-inspection
Test & Inspektion X-Ray Inspection and Test Products Corporate | Globale Standorte (Englisch) | Sprachen Nur Sparte Alles von Nordson Home Produkte Bondtest Systeme Mikro Werkstofftester Wafer Inspektion und Messung X-ray Inspektion X-ray
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