Electronics Forum | Tue Sep 12 08:39:38 EDT 2017 | jefri_simorangkir
we are turning on the printer, suddenly the printer is off after checking there is solderball on pad capacitor component 0603 our question is what can a solderball stuck on one pad can when melting and causing shortsolder (being connected with other
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Wed Feb 03 17:39:41 EST 1999 | Rich Croteau
Name of equipment that automatically does the solderballing. Pads are .010" on .050" pitch
Electronics Forum | Tue Jun 04 10:39:45 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Feb 08 03:55:18 EST 2005 | Rob.
We got ours hooked on solderballs - 2 birds with one stone!
Electronics Forum | Mon Oct 27 14:28:19 EDT 2008 | patrickbruneel
Do you refer to the highlight in the picture as a solderball? Looks more like copper to me.
Electronics Forum | Tue Jun 15 13:36:30 EDT 2004 | John S
We are launching a new product and are fairly new to reflow soldering. A concern that has arisen is a fairly consistent solder ball that forms at an electrolytic capacitor. We changed to a homebase aperture design on our passives to eliminate mid-c
Electronics Forum | Mon Sep 20 16:27:58 EDT 2004 | blnorman
Besides the processing tests (different print speeds, print delay times, etc.) one test we've had to use is humidity exposure. Solderballing due to high outside humidity is a problem in our plant. So we expose paste to 85% humidity for various time
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
