Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Tue Jan 08 14:54:10 EST 2002 | Yannick
Hi, I experience some trouble with my solder joint recently. And I'm wondering if someone could help me with this. First I use a thermocouple wich I must tape to the board to profile my temperature. I want to buy the Temprobe from Saunder Tech
Electronics Forum | Thu May 23 16:30:44 EDT 2002 | Mike Konrad
Solder balls can be removed with most cleaning systems, batch or inline. Ultrasonic will work but may also cause other problems. A high pressure spray-in-air cleaning system with a chemical additive (for no-clean removal) will work best. If you no
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
Electronics Forum | Wed May 12 07:53:28 EDT 2004 | solderpro
Lets make it easy on the poor guy, some are correct, check you profile but remember one thing most do not apply, it is important to match the type of paste you are using with the style of oven and configuration. send a direct email and I will give so
Electronics Forum | Mon Aug 16 04:55:30 EDT 2004 | roel
Concerning the solder-balls, there are a few causes for this. Try to slow down your solder-speed (P.e 80cm/min). Can you measure temperature after the pre-heat zone? Are there also blow-holes in the joints? Personally I think there is some water in t
Electronics Forum | Thu Dec 16 18:36:01 EST 2004 | mattkehoe
We use water soluble solder paste. When it gets a little dried out, can we add something to rejuvenate it? Liquid flux? We do not place components, just print and reflow the solderpaste so solderballs, spattering, and other issues like those are of
Electronics Forum | Fri Sep 22 13:15:19 EDT 2006 | jaimebc
We are currently experiencing some MCSB's on 0603 components. I am looking into experimenting with the stencil thickness from 6 mil to 5 mil and also using Radiused inverted homeplate ( 20%60%20)to eliminate or reduced this problem. We are using lea
Electronics Forum | Mon Sep 25 16:31:41 EDT 2006 | SWAG
We are just getting into full production on a handful of lead-free builds. We are finding that the specific lead-free paste we are using is very susceptible to shelf life and dwell time. Much, much more than our experience with leaded. We have had