Electronics Forum | Wed May 12 07:53:28 EDT 2004 | solderpro
Lets make it easy on the poor guy, some are correct, check you profile but remember one thing most do not apply, it is important to match the type of paste you are using with the style of oven and configuration. send a direct email and I will give so
Electronics Forum | Mon Aug 16 04:55:30 EDT 2004 | roel
Concerning the solder-balls, there are a few causes for this. Try to slow down your solder-speed (P.e 80cm/min). Can you measure temperature after the pre-heat zone? Are there also blow-holes in the joints? Personally I think there is some water in t
Electronics Forum | Thu Dec 16 18:36:01 EST 2004 | mattkehoe
We use water soluble solder paste. When it gets a little dried out, can we add something to rejuvenate it? Liquid flux? We do not place components, just print and reflow the solderpaste so solderballs, spattering, and other issues like those are of
Electronics Forum | Thu Nov 30 19:55:30 EST 2006 | greg york
This may be worth checking out are you sure it is flux residue and not undercured plasicizers coming from solder resists due to the higher Lead Free temperatures killing the undercured resist, this causes many no faults found and bridging, solderball
Electronics Forum | Thu Mar 29 14:55:59 EDT 2007 | HOSS
Hello, I searched the forums and found little specific info on LGAs with interior lands. This is not a QFN with a center pad. This is a multi-row BGA without solderballs. I'm looking for recommendations on PCB land to part land ratio, stencil a
Electronics Forum | Fri Sep 14 09:30:29 EDT 2007 | russ
That is inherent issue with lead free, you may want to ask your customer to reconsider this specification, It was probably initiated during the pb days when an exposed pad could signify a reflow issue. Overprinting will give you solderballs and unle
Electronics Forum | Tue Jan 20 07:57:00 EST 2009 | mrdtech
Depends on the solder paste. If it has been on the stencil for 24h there is a good chance that the paste is destroyed. You can however check if it has not dried out too much by letting the stencil printer do a few strokes and see if the paste still h
Electronics Forum | Thu Aug 06 19:20:09 EDT 2009 | boloxis
easy, just dip the ICs on a very weak solution of Nitric Acid, by very weak I mean like drops of Fuming Nitric acid in a half full DI water beaker. Place the beaker on a Ultrasonic bath and dip/shake the ICs in the solution in 5~ 10 seconds only. You
Electronics Forum | Thu Aug 22 16:25:18 EDT 2019 | scotceltic
Yes, unfortunately a lot of datasheets these days do not contain the temperature resistance to determine if it can handle the PIP application. In the past I have always used a 250 C at a min of 5 sec for the material. Also, the part should have sta
Electronics Forum | Thu Aug 24 12:35:30 EDT 2000 | Wolfgang Busko
The dilemma with this is that the search in the archive is often not that enlighting as someone might hope. Fact is that each new question (and the answers as well) on old topics adds to the archive making it not better. Well, and than look for the r
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