Industry Directory | Consultant / Service Provider
We work on the physical design, reliability and failure analysis of electronic components, solder joints and PCB assemblies. We provide expertise in the assessment of both standard SnPb and Pb-free solder joint reliability.
Industry Directory | Manufacturer
Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.
New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
New Equipment | Test Equipment
KOH YOUNG Zenith 3D AOI Ultimate Solution for Inspection Challenges Incomparable True 3D Inspection Performance IPC-based Solder Joint Inspection AI-Powered Auto Programming (KAP) KOH YOUNG Zenith 3D AOI KOH YOUNG Zenith 3D AOI The Industry’s
Electronics Forum | Thu Sep 29 19:18:24 EDT 2005 | HLy
Hi, I noticed that the solder joints on my BGAs end up with a lot of wrinkles after reflow. See picture at: http://pstr-r02.ygpweb.aol.com/data/pictures/02/01A/17/DD/E3/9E/n8BhepQLFDs6GMSwaRNxPCTWR5NdpUJZ0300.jpg Does anybody have any ideas what cau
Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris
the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | X-Ray Inspection
CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Sold
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Norcross, Georgia USA | Production
Solder Technician Reports to: Supervisor Responsibilities: 1) Melts and applies solder along adjoining edges of workpieces to solder joints, using soldering iron, gas torch, or electric-ultrasonic equipment. 2) Grinds, cuts, buffs, or bends edge
Career Center | Kirkland, Portsmouth N.H Canada | Quality Control
Contract Electronic Manufacturer of PCB Assemblies seeks experienced QA Inspector with CLUSO VISION SYSTEMS First Article Inspection experience. Excellent communication skills. Computer literate, strong sense of urgency, and motivated with good follo
Career Center | Princeton, Texas USA | Production,Quality Control
I have years of experinece in the electronics field which include: component verification, prepping thru hole parts, building pc boards, soldering thru-hole and smt boards, QA etc.
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| https://www.eptac.com/webinars/assembly-understanding-the-hardware-side-of-ipc-a-610
– Understanding the HARD(ware) Side of IPC-A-610 The Accept/Reject Criteria for soldered joints right? That is what IPC-A-610 "Acceptability of Electronic Assemblies" is all about. Well, yes and no
ASCEN Technology | https://www.ascen.ltd/Video_Channel/Non-standard_equipment/516.html
. Even relatively average boards have thousands of soldered joints, and these are where the majority of problems are found. This increase in the complexity of boards also means that manual inspection is not a viable option these days
