Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist
Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.
Electronics Forum | Thu Dec 11 19:24:55 EST 2008 | gregoryyork
some lead free solders do not flow well and need encouragment. what are you using solder/flux wise and machine/settings including dwell times cheers greg
Electronics Forum | Mon Jun 05 14:17:18 EDT 2000 | C.K.
Dream: Yes, VIA's are connected to actual SMD pads via traces - roughly .030" from the pad. The VIA is .013" in diameter, and the excess solder bleeds out of the actual VIA barrel after the 1st reflow.... -CK
Electronics Forum | Fri Dec 12 10:00:57 EST 2008 | gregoryyork
Hi Patrick Yes we have some that you cant tell the difference. BUT machine set up and angle are extremely important with Lead Free as is the dosing alloy. Cheers Greg
Electronics Forum | Fri Dec 12 11:58:19 EST 2008 | gregoryyork
Hi Patrick We get this with the right settings in a small machine without Nitrogen Nice picture of yours as well Cheers Greg
Electronics Forum | Thu Dec 18 18:21:34 EST 2008 | gregoryyork
Hi Peter Its looks on a par with mine so not bad at all but our alloy is considerably cheaper than SAC305 and significantly shinier We used our 10-75-30-R VOC free flux with topside of 100 - 105C Cheers Greg
Electronics Forum | Mon Oct 15 14:36:03 EDT 2018 | davef
The methods of verifying PTH hole-fill. 1 Visual inspection 2 x-ray inspection works very well for inspecting such a connector for voiding and hole fill. View the connector off-vertical, at between 30 and 45 degrees. As always, the solder connect
Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef
Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using
