Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef
We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake
Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl
on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev
Electronics Forum | Thu Nov 10 23:43:33 EST 2022 | sarason
Are you using the correct nozzle for 0402? Cant remember the number OTTOMH but 501 rings a bell. somewhere I have the table, it is in the Juki service manual IIRC. This would explain placing all others okay but 0402 is not very good , Senoirtech is c
Electronics Forum | Fri Jan 31 11:45:52 EST 2014 | emeto
Hi, to get better image you will probably need higher voltage(depending on how close you want to look). The closer you get the higher the voltage should be. Here are some tips for machine calibration: 1. Make sure your board is on focus. I don't kn
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Mon Aug 18 11:20:08 EDT 2008 | pjc
Stencil apertures are cut to deposit solderpaste onto the annular ring, provided its wide enough. Then you can place a solder preform if needed to ensure there is enough solder to fill the barrel. Here is some information on solder preforms: http://
Electronics Forum | Mon Oct 03 15:13:00 EDT 2011 | tombstonesmt
It sounds to me that it's a heat transfer issue. The solder is only bonding to the lead on not the barrel correct? Does your selective solder equipment have any type of heating source? Can you "dwell" on that particular joint? On some of our products
Electronics Forum | Wed Dec 10 09:29:59 EST 2008 | rgduval
Oops...just noticed you were referring to wave soldering. We'd still suggest a water-soluble flux, instead of the no-clean; especially at wave soldering. Also, checking pre-heat temps, and dwell time on the pot. Is the wave a chipper wave? If not
Electronics Forum | Fri Sep 16 11:58:46 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
Electronics Forum | Fri Sep 16 13:19:59 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
