Electronics Forum | Wed Apr 27 08:19:41 EDT 2011 | charliedci
We are in the process of changing over our wave solder flux from alcohol based no clean to VOC free water based no clean. We are running an old Eletrovert with foam fluxer, tin lead solder. After preliminary testing on scrap boards and now starting t
Electronics Forum | Mon Nov 27 17:33:25 EST 2000 | Dave F
Ramon: I guarantee you there is corrosion on the solderable surfaces of your board. The issues are: * Flux selected is capable of removing the corrosion at hand. * Processes for applying the flux and soldering the board are effective for the sele
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Thu Jul 17 20:20:21 EDT 2014 | mac5
Hi June, The biggest issue with an OSP finish is as soon as the PCB sees a heat cycle (reflow or wave) the finish will begin to degrade. If you have a single sided SMT assembly with THT components installed downstream it works pretty good. But a dou
Electronics Forum | Tue Dec 26 22:18:20 EST 2006 | davef
Common methods to replate components are: * Barrel plating http://www.finishing.com/Library/zemo/barrel.html * Hot solder dipping - MIL-F-14072 M258 Certainly you can do this yourself by dipping the component leads into a solder pot containing lead
Electronics Forum | Wed Oct 08 11:16:12 EDT 2014 | cbeneat
We are having an intermittent issue with a certain board on our wave solder line, machine is a Vitronics 6922 Delta Wave, leaded process. There are 2 fuse holders on one edge of the board that are not getting solder all the way thru the barrel every
Electronics Forum | Thu Nov 17 15:40:23 EST 2005 | Hoss
We have a board that has been diagnosed with inner layer separation from the barrel wall. This board is .093 thick and 12 layers. Several layers, in some cases, have little or no thermal relief making soldering difficult. We have since switched t
Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist
What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
