Electronics Forum | Thu Mar 16 17:33:40 EDT 2017 | dontfeedphils
Voiding, fracturing, barrel-fill, I'm sure there are some I'm missing.
Electronics Forum | Fri Dec 12 11:02:20 EST 2008 | patrickbruneel
Greg, I totally agree with you that machine settings are very important in wave soldering and soldering in general. I disagree that lead free alloys can produce wetting like in the attached picture (leaded alloy). Lead free alloys have a much higher
Electronics Forum | Tue Dec 16 16:49:22 EST 2008 | scottd3
We ran into this problem before, on all of our models. We never quite found out the reason, we do know that if the PCB is passed through a reflow oven that is extremely dirty with evaporated solder paste flux, it will make it extremely difficult (or
Electronics Forum | Wed Apr 27 08:19:41 EDT 2011 | charliedci
We are in the process of changing over our wave solder flux from alcohol based no clean to VOC free water based no clean. We are running an old Eletrovert with foam fluxer, tin lead solder. After preliminary testing on scrap boards and now starting t
Electronics Forum | Mon Nov 27 17:33:25 EST 2000 | Dave F
Ramon: I guarantee you there is corrosion on the solderable surfaces of your board. The issues are: * Flux selected is capable of removing the corrosion at hand. * Processes for applying the flux and soldering the board are effective for the sele
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Thu Jul 17 20:20:21 EDT 2014 | mac5
Hi June, The biggest issue with an OSP finish is as soon as the PCB sees a heat cycle (reflow or wave) the finish will begin to degrade. If you have a single sided SMT assembly with THT components installed downstream it works pretty good. But a dou
Electronics Forum | Tue Dec 26 22:18:20 EST 2006 | davef
Common methods to replate components are: * Barrel plating http://www.finishing.com/Library/zemo/barrel.html * Hot solder dipping - MIL-F-14072 M258 Certainly you can do this yourself by dipping the component leads into a solder pot containing lead
Electronics Forum | Wed Oct 08 11:16:12 EDT 2014 | cbeneat
We are having an intermittent issue with a certain board on our wave solder line, machine is a Vitronics 6922 Delta Wave, leaded process. There are 2 fuse holders on one edge of the board that are not getting solder all the way thru the barrel every
.gif)
