Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef
Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using
Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
Electronics Forum | Sat Nov 08 09:10:16 EST 2008 | davef
SN100 was designed for selective soldering and producing low levels of voiding. But thin barrel plating is a common cause of voids in wave and selective soldered connections, as you say. As a result, you checked the plating thickness and it was accep
Electronics Forum | Thu Aug 11 21:43:19 EDT 2005 | Ken
Those temp stickers are useless unless you can stick them into the copper barrel. They can only determine "skin" temperature which has nothing to do with what is happening in the barrels. Your solder is filling the barrel then going cold. I'll gua
Electronics Forum | Fri Sep 19 11:39:38 EDT 2003 | joeherz
We have recently started building a new assembly that is exhibiting some strange behavior. We are seeing what look like blow holes in wave soldered joints. When the joints are touched up, the solder in the barrel will actually bubble up from the ho
Electronics Forum | Thu Jul 17 14:30:42 EDT 2008 | tommyg_fla
1500 lbs) vary by a couple of degrees) were standard. I thought that flux penetration into PTH barrel and solder pot immersion depth and solder pot parallelism would be also critical factors. We are using the ECD WaveRider to measure the implied sold
Electronics Forum | Thu Dec 18 14:38:41 EST 2008 | easton
I think the BLT solder joints look very shiny for no-lead. We are getting very good top side solder with ours though. They look like this. - Gold Enig plating - Alpha EF-6100 Flux - SAC305 - Preheat topside temperatures at 110 to 120C
Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
.png)
