Electronics Forum | Fri Jun 04 11:31:27 EDT 1999 | Tony
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Wed Dec 10 08:30:20 EST 2008 | rgduval
Are you using no-clean solder, or just no clean flux? If you're using a solder with WS flux in the core, and a no-clean flux; we'd suggest switching to a WS flux to help during the soldering. If you are using a no-clean solder/flux combination, you
Electronics Forum | Thu Jun 03 20:09:56 EDT 1999 | C.K.
I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." These def
Electronics Forum | Fri Jun 04 11:30:40 EDT 1999 | Earl Moon
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Mon Aug 11 17:48:39 EDT 2003 | Brian W.
Assuming you are working to IPC standards, are you working to Class2 or Class 3? Class 2 has an exception to the 75% barrel fill (para 6.3.1, page 6-7). "As an exception to fill requirements of Table 6-2 on PTHs with thermal planes or conductor
Electronics Forum | Wed Aug 04 17:16:13 EDT 2004 | Richard
Can anyone comment on inspection criteria for PIH applications. I'm of the opinion that the inspection criteria used for wave soldered joints should be used for PIH. Some colleagues believe that a bottom side fillet is not necessary since the solde
Electronics Forum | Fri Aug 06 07:16:36 EDT 2004 | davef
When moisture outgasses through plating, it continues through the molten solder, causing a meak solder connection. There's another issue with thin plating that we haven't focused on in this thread. If plating is thin, the stress on the barrel of a
Electronics Forum | Tue Jan 25 07:49:17 EST 2005 | davef
On "Solder beading seemed to be a problem", consider revisiting the thermal recipe used for reflow. The PTH barrel may not be getting warm enough. On "Component not being designed to pin in paste work, with no proper standoffs", consider: * Using a
Electronics Forum | Wed Jan 06 09:38:59 EST 2010 | lynn_norman
Via failure could be caused by cracks in the barrel, or thin plating, or fractures in the traces leading to the vias, . X-ray analysis could pick up a fractured trace and cross-sectioning of the vias could pick up the cracks and thin plating. Secon
Electronics Forum | Fri May 18 13:30:52 EDT 2001 | mparker
I will start with the statement that I think it is great that we have the ability to solder SMT components that emulates wave soldered components. With that in mind, I would want to find acceptance criteria to be similiar, regardless of the solder me
