Full Site - : soldering defect inspection (Page 40 of 838)

Ball Grid Array (BGA) Voiding Affecting Functionality

Technical Library | 2020-11-09 16:59:53.0

A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.

ACI Technologies, Inc.

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Surface Mount Technology Association (SMTA)

Practical Support on Cleaning and Contamination Monitoring Processes Printed Board Assembly Cleaning and Contamination Testing Center to Debut at IPC APEX EXPO 2013

Industry News | 2012-12-03 19:52:39.0

Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

Vi Technology 3D XPi 400L

Vi Technology 3D XPi 400L

Used SMT Equipment | Visual Inspection

Make: VI Technolgoies Model: 3D XPi 400L Solder Paste Inspection Vintage: 2008 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow

Lewis & Clark

Selective Soldering Nozzles & Tooling (Ace KISS, Pillarhouse, RPS, & more)

Selective Soldering Nozzles & Tooling (Ace KISS, Pillarhouse, RPS, & more)

New Equipment | Selective Soldering

Count On Tools has been a manufacturer of high quality, low cost nozzles and associated components for the SMT & PCB Assembly industries for over 20 years. Our commitment and goal is to be the number one supplier of precision engineered SMT nozzles &

Count On Tools, Inc.

SMTA International Conference Program Announced and Registration Now Open

Industry News | 2019-06-26 19:49:34.0

The SMTA is pleased to announce that the program and registration for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai. Taking place September 22-26, 2019 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 15 professional development courses, 120 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

The Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers.

The Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers.

Videos

DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl

ITW EAE

Solder Paste Application Standard Available in Danish IPC-7527 Establishes Two Firsts for IPC

Industry News | 2012-12-13 13:23:38.0

IPC-7527, Krav til Tinpastatryk, is also the first standard ever developed that focuses on the application of one of the industry’s most basic infrastructure elements, solder paste.

Association Connecting Electronics Industries (IPC)

Koh Young Koh Young Calibration jig SPI/ AOI

Koh Young Koh Young Calibration jig SPI/ AOI

Parts & Supplies | SPI / Solder Paste Inspection

Koh Young Calibration jig SPI /AOI CALIBRATION FEE CALIBRATION FEE ​ NXT/XPF Feeder Calibration Jig ..NXT/XPF-FCS  ​ YV feeder calibration jig ..YV feeder calibration jig  ​ CL Feeder calibration ..YMH CL  YAMAHA SS feeder calibration jig SS

Qinyi Electronics Co.,Ltd

3D SPI manufacturer

3D SPI manufacturer

Videos

1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用

CNSMT CO.LTD


soldering defect inspection searches for Companies, Equipment, Machines, Suppliers & Information

INSPECTION TECH
INSPECTION TECH

Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.

Equipment Dealer / Broker / Auctions

Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea

Phone: +82-1029254936

SMT feeders

Component Placement 101 Training Course
Blackfox IPC Training & Certification

Stencil Printing 101 Training Course
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications