In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
New Equipment | Cleaning Equipment
Cleans screens, stencils, coating carriers, solder carriers, misprints Economy cleaning system for screens, stencils, PumPrint stencils The kolb PSE economy line is a quality series of advanced cleaning systems, which focuses on all essen
New Equipment | Cleaning Equipment
PSE 300 VS Cleans screens, stencils, squeegees and spatulas The kolb PSE economy line is a quality series of advanced cleaning systems, which focuses on all essential criteria for a qualified cleaning process and therefore stands for attra
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
New Equipment | Soldering Robots
Automatic Solder Paste Printer CP-18M https://faroads.com/automatic-solder-paste-printer-cp18m/ Model Automatic SMT PRINTER CPM-18 PCB board size Max 450mm * 350mm Min 50mm * 50mm Transfer Speed
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
![[SEC] 3D In-line AXI Solution X-eye 6300 X-ray Inspection Machine](https://img.youtube.com/vi/w-_v-XDRKro/sddefault.jpg)
3D In-line Automated X-ray Inspection system (machine) Model: X-eye 6300 X-ray Tube: 160kV / 500 µa Table Size: Max. 330 x 250mm Min. 50 x 50mm Detector: 12 inch FPXD Defection type (Application): BGA, PoP, chip, QFN, QFP, etc. - High-speed In-lin
New Equipment | Cleaning Equipment
PSE 300 2HY Cleans screens, stencils, PCBAs, misprints and tools The kolb PSE Economy line is a quality series of advanced cleaning systems, which focuses on all essential criteria for a qualified cleaning process and therefore stands for
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
