Electronics Forum | Tue Dec 14 15:21:41 EST 1999 | BJL
This may be the nickle paladium lead material or an 87/13 tin lead plating on the leads. Paladium and 87/13 has a slower disolution rate and takes longer for solid joint to be created between two metal surfaces. Reflow temp must allow the joint to be
Electronics Forum | Thu May 02 09:33:30 EDT 2013 | 15009
Looking for advice on soldering lead free paste to a board with very heavy gold plating. I have learned from the Customer that this is HARD GOLD and that it is 10-20 Micro Inches Hard Gold over 100 Micro inches of Nickel. When we reflowed the solde
Electronics Forum | Sun Nov 24 10:12:44 EST 2002 | kcorrin
Thanks for your response Dave. I did look at the bare boards after wave solder and they seem to solder fine in that process. I do not see any soldermask bleed on bare boards. Regarding "thin" plating...I have had issues in the past when the board sup
Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Fri May 03 16:06:44 EDT 2013 | hegemon
To be short, no change in profile is going to get you through this. As I recall the point of hard gold is to retard the wetting process, so no surprise here. For example a connector might have hard gold plating at the mating surface, but not at t
Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian
| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a
Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon
| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,
Electronics Forum | Tue Aug 07 19:32:40 EDT 2007 | davef
Zinc from the brass diffuses into the solder and reacts with tin causing dezincification. Dezincification is a specific type of de-alloying, or selective, leaching corrosion of brass fittings. This type of corrosion selectively removes zinc from th
Electronics Forum | Thu Sep 16 17:22:16 EDT 1999 | DaveJ
We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a recomm
