Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Thu Jan 29 09:18:36 EST 2015 | davef
Nichrome, manganin, phosphor bronze etc are easy to solder ... the hard part is removing the corrosion * Manganin: 86% copper, 12% manganese, 2% nickel. Often, it's used in making cryogenic measurements, due to its low heat loss. * Select a flux for
Electronics Forum | Tue Sep 24 12:30:11 EDT 2002 | Claude_Couture
I'm just shooting ideas here, but maybe a via hole in the middle of the solder pad would drain the excess solder by capillary force? Or using a tin plated PCB and printing flux only, then place and reflow. depending on the thickness of the tin plati
Electronics Forum | Fri Oct 14 11:56:49 EDT 2005 | patrickbruneel
Mika, 1.) Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? Answer: The thicker the board the further the solder has to travel and the more you depend on solderability of boards and components, machine
Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
Electronics Forum | vincentl |
Thu Sep 20 14:17:36 EDT 2018
Electronics Forum | Thu Aug 06 19:20:09 EDT 2009 | boloxis
easy, just dip the ICs on a very weak solution of Nitric Acid, by very weak I mean like drops of Fuming Nitric acid in a half full DI water beaker. Place the beaker on a Ultrasonic bath and dip/shake the ICs in the solution in 5~ 10 seconds only. You
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