Full Site - : soldering to nickle plating (Page 4 of 25)

SHENMAO to Exhibit Low-Temperature Solder Pastes at SMTA Ohio Expo

Industry News | 2019-07-09 20:13:00.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.

Shenmao Technology Inc.

New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues

Industry News | 2023-03-16 14:42:07.0

SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.

Shenmao Technology Inc.

SHENMAO to Exhibit Low-Temperature Solder Pastes at ECTC

Industry News | 2019-04-15 06:42:26.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.

Shenmao Technology Inc.

SHENMAO America to Solve Solder Paste Problems at APEX

Industry News | 2018-01-24 20:47:58.0

SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.

Shenmao Technology Inc.

SHENMAO America Appoints New Rep to Expand Midwestern Support

Industry News | 2018-12-05 19:10:43.0

SHENMAO America, Inc. is pleased to announce the appointment of MIDwest TEKnologies as its representative in the Midwest region. The manufacturers’ representative will provide sales and customer support for SHENMAO in MN, ND, SD and IA.

Shenmao Technology Inc.

SHENMAO Offers Quality Solarjoin PV Ribbon to Meet High-Reliability Requirements

Industry News | 2019-03-31 20:29:23.0

SHENMAO America has more than 40 years of experience in delivering solder materials with effective research and development and total solution capabilities.

Shenmao Technology Inc.

SHENMAO America to Participate in the eSMART Factory Conference

Industry News | 2018-05-20 18:31:27.0

SHENMAO America today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.

Shenmao Technology Inc.

SHENMAO to Exhibit New Solder Pastes with NeVo at productronica

Industry News | 2021-10-11 16:08:26.0

SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.

Shenmao Technology Inc.

SHENMAO to Debut New Pastes & Fluxes at electronica China

Industry News | 2019-03-05 17:59:34.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.

Shenmao Technology Inc.

SHENMAO to Present at the 31st Annual Electronics Packaging Symposium

Industry News | 2019-08-12 20:00:01.0

SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”

Shenmao Technology Inc.


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