Industry News | 2018-05-08 19:17:52.0
Thermaltronics have appointed Adopt SMT as the exclusive distributor of the new Thermaltronics Soldering Robot in Germany. They will exhibit the new Thermaltronics robot, TMT-R9800S, in Hall 4A, Booth 458 and 460, at the upcoming SMT/Hybrid/Packaging show scheduled to take place June 5-7, 2018 at the Messe in Nuremberg, Germany.
Industry News | 2020-01-06 16:02:00.0
Nihon Superior Co. Ltd. is pleased to announce plans to showcase its new TipSave N flux-cored solder wire in Booth #2043 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company also will exhibit SN100CV P608 D5 solder paste.
Industry News | 2013-11-18 16:42:52.0
Microtronic GmbH has entered into a strategic partnership with Loadpoint to offer a dicing and grinding service.
Industry News | 2013-05-13 15:09:59.0
FCT Assembly today announced that it has installed new Mitutoyo Deep Throat Micrometers to accurately measure the step etch depth over the entire surface of the stencil.
Industry News | 2022-01-03 07:24:21.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2014-04-07 20:04:08.0
Metcal today announced that it will showcase industry-leading products in Booth #9-327 at SMT/Hybrid/Packaging, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2007-10-29 17:10:53.0
Aesch/Switzerland � Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it will highlight the CDS6700 dispenser with the new piezo flow valve for solder paste dispensing in booth A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2011-06-13 17:22:02.0
Everett Charles Technologies’ (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth #5670 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco. A new eight-page ZIP® Product Portfolio brochure also will be available at the ECT CPG booth.
Industry News | 2011-11-03 21:02:04.0
LPKF will highlight the ProtoMat S-Series, E33 and ProtoLaser S in Stand #23 at the upcoming PCB Carolina Expo.
Industry News | 2024-02-26 14:01:19.0
Indium Corporation advisor, and founder/principal of DS&A LLC, Dave Saums will present on innovative thermal materials for semiconductor testing at TestConX 2024, held in Mesa, AZ, March 3-6. Saums will open the conference with a tutorial on March 3 and deliver a technical presentation on the topic on March 5.
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