Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2018-10-18 10:04:27.0
How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality
Industry News | 2024-01-29 11:36:51.0
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.
Industry News | 2010-02-25 23:27:16.0
MORRISVILLE, NC - February 2010 - Juki Corporation will showcase a range of leading products at the upcoming Virtual PCB, the industry’s only online tradeshow, scheduled to take place March 2-4, 2010 online at www.virtual-pcb.com.
Industry News | 2011-10-07 23:03:24.0
LPKF will exhibit the ProtoMat S-Series, E33 and ProtoLaser S at the upcoming SMTA LA/Orange County Expo & Tech Forum.
Industry News | 2020-11-06 17:27:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2009-03-16 17:47:59.0
HAMPSTEAD, N.H. - March 2009 - P.D. Circuits, Inc., (PDC) specializing in delivering the highest quality PCBs, technical support, and service to OEM and EMS companies worldwide, announces that it provided maximum support to the Space Coast SMTA Chapter's March meeting, which featured a panel discussion of �Solder Process Failure Analysis.�
Industry News | 2023-10-30 19:24:35.0
Ventec International Group Co., Ltd. (6672 TT) will once again team up with partner Taiyo to promote the synergy between Ventec's substrate materials and Taiyo solder masks, at Productronica 2023, Munich November, 14-17 in Hall B3, Booth 242.
Industry News | 2011-03-07 14:43:24.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in its distributor, Tronic Electronics HK Ltd.'s, Booth 2452 Hall 2 at the upcoming Semicon China Exhibition. A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.
