Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2009-03-16 17:47:59.0
HAMPSTEAD, N.H. - March 2009 - P.D. Circuits, Inc., (PDC) specializing in delivering the highest quality PCBs, technical support, and service to OEM and EMS companies worldwide, announces that it provided maximum support to the Space Coast SMTA Chapter's March meeting, which featured a panel discussion of �Solder Process Failure Analysis.�
Industry News | 2023-10-30 19:24:35.0
Ventec International Group Co., Ltd. (6672 TT) will once again team up with partner Taiyo to promote the synergy between Ventec's substrate materials and Taiyo solder masks, at Productronica 2023, Munich November, 14-17 in Hall B3, Booth 242.
Industry News | 2011-03-07 14:43:24.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in its distributor, Tronic Electronics HK Ltd.'s, Booth 2452 Hall 2 at the upcoming Semicon China Exhibition. A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.
Industry News | 2015-10-21 19:35:48.0
Techcon Systems today announced they will exhibit a full line of valves and robots in Hall A4, Booth 221 at the upcoming Productronica International Trade Fair, scheduled to take place November 10-13, 2015 at the Messe in Munich, Germany.
Industry News | 2018-02-12 20:56:18.0
Nordson YESTECH will feature the new high speed FX-942 dual sided PTH automated optical inspection system for populated printed circuit boards, at the annual APEX 2018 show held at the San Diego Convention Center, in San Diego, California from February 26th to March 1st. They will conduct live demonstrations in the booth of their complete line of AOI and Conformal Coating inspection systems.
Industry News | 2011-12-01 13:19:22.0
Reed Exhibitions recently announced that NEPCON China 2012 will take place at the Shanghai World Expo Exhibition & Convention Center from April 25-27. The event will boast four new segments featuring electronic static discharge, electronics manufacturing automation, advanced electronics packaging and touch panel.
Industry News | 2017-11-28 09:32:15.0
SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.
Industry News | 2022-11-15 12:17:46.0
Indium Corporation's David Socha, technology assessment manager, will present on Indium Corporation's innovative 3D-EZ-Release™ build plate, a cutting-edge technology that allows for the quick release of powder bed fusion (PBF) metal printed parts, at the TCT Conference at Formnext at 12:20 p.m. on Friday, Nov. 18 in Frankfort, Germany.
Industry News | 2018-05-16 19:57:33.0
SHENMAO America today announced plans to exhibit at the SMTA Michigan Expo & Tech Forum, scheduled to take place Tuesday, May 22, 2018 at Laurel Manor in Livonia, MI. Company representatives will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 is designed to lengthen stencil life and eliminate head-in-pillow (HiP) defects, voids, slumping and non-wetting opens.
