Full Site - : soldering to nickle plating (Page 10 of 25)

Parvus Unveils Three Fanless 800MHz Pentium III PC/104-Plus CPU Modules Designed for -40C to +85C Extended Temperature

Industry News | 2005-07-11 12:52:53.0

Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463

Parvus Corporation

Pickering Electronics’ Preview for Semicon West USA, July 9th to 11th, Moscone Center, San Francisco, booth 5664, North Hall

Industry News | 2013-07-10 00:54:29.0

Pickering Electronics will highlight the following products amongst other products at Semicon West

Pickering Electronics

Preview for AdoptSMT UK - Southern Manufacturing and Electronics show from the 21st to 23rd March 2017, Farnborough, UK

Industry News | 2017-02-03 13:13:40.0

Market Leader AdoptSMT will showcase at Southern Manufacturing an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.

AdoptSMT Europe GmbH

Preview for AdoptSMT Europe at Amper Electronics Show from March 21 to 24th, Brno, Hall F Stand No. 0.02

Industry News | 2017-03-08 16:04:03.0

Market Leader AdoptSMT will showcase at Amper Brno an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.

AdoptSMT Europe GmbH

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Industry News | 2017-11-28 19:46:04.0

SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

Industry News | 2018-09-18 20:19:23.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.

Shenmao Technology Inc.

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

Soldering to nickle plated kovar parts

Electronics Forum | Tue Mar 09 21:17:10 EST 2004 | gm05688

When soldering a metalized germanimum window to a nickle plated kovar part, I would like to understand the intermetalic. Does the nickle plate actually melt or will the solder(SN63)simple stick to the nickle and not cause nickle to reflow? Any one ou

Soldering to nickle plated kovar parts

Electronics Forum | Tue Mar 09 22:26:17 EST 2004 | davef

You should to be soldering to the nickel. The intermetallic is Ni3Sn4. "At relatively low temperatures, the tin-nickel layers form about as rapidly as the tin-copper layers do, but at higher temperatures their growth rate is distinctly lower. At 10

soldering to thick gold plating

Electronics Forum | Tue Jul 11 14:09:54 EDT 2006 | Chunks

Not reflowing completely. Slower = hotter. Try a slower conveyor speed.


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