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ENIG PCBs with red soldermask Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm Min. line width: 3 mils Min. line spacing: 3 mils Surface finishing: HASL
Rogers Material 1.6mm Thickness 2 Layers 1oz copper thickness Gold Plating Surface Treatment red Solder Mask e-test
Electronics Forum | Wed Oct 01 21:22:37 EDT 2003 | ramanandkini
We have a 1.6 mm thick automotive PCB board of size 35x70mm. One of our vendor has given us a batch with lesser soldermask thickness 5~8 microns. Will this affect the circuit board on a long term. What should be standard for the soldermask thickness?
Electronics Forum | Thu Oct 02 11:04:48 EDT 2003 | russ
Out of curiousity, Isn't soldermask only used as a solder processing aid and to cover the copper? Russ
Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
Industry News | 2018-10-18 11:08:57.0
What are PCB Thickness Options?
Technical Library | 2016-07-21 18:16:06.0
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material, but can be significantly impacted by PCB fabrication practices. In addition to appropriate circuit materials and circuit design configurations to meet target performance goals, a number of PCB material-related issues can affect final performance, including the use of soldermask, the PCB copper plating thickness, the conductor trapezoidal effect, and plating finish; understanding the effects of these material issues can help when fabricating high-frequency circuits for the best possible electrical performance.
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
| http://www.thebranfordgroup.com/dnn3/Auction/MULA0623.aspx
: Glenbrook Technologies RTX-113HV X-Ray System Hitachi X-Strata 920 X-Ray Coating Thickness Measurement System (2018) Oxford Instruments CMI 760 CU Tester w/ Wise FlatStar 650 Planerizer Optek V-Series Video Inspection
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