Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
Electronics Forum | Wed Feb 05 17:37:40 EST 2003 | mk
Investigate "Solid Solder Deposition"
Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep
We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f
Electronics Forum | Fri Mar 16 17:15:51 EDT 2007 | davef
Ask the board fabricator to: * Fill the vias with resin. * Then metalize and copper plate the filled via along with the pad. * Then plate with solderability protection. This results in what appears to be a solid pad. For more, look here: http://www
Electronics Forum | Fri Oct 13 05:21:08 EDT 2000 | Robert Steltman
Looking at the original post, it seems that the white residue is formed on the board after wave soldering and becomes evident when it has been left standing for a while. From what I understand, it seems that the solids content of the "no clean" flux
Electronics Forum | Thu Jan 16 05:42:18 EST 2003 | nifhail
I've a query. I have one new Customer whom insisted us to use RMA paste on their product. The problem is, on some of their products they use via hole as the test point in where all the PCB finished are ENTEK and as usual I have to print solder paste
Electronics Forum | Thu Jun 04 09:25:21 EDT 1998 | Chrys
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F
Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu
Electronics Forum | Fri Dec 04 19:17:03 EST 1998 | Jason
Jeff, I used conductive epoxy for diebonding and chipcaps on hybrid xtal controlled osc. We were applying via stencil printer, then curing in a KME vertical cure, a real foot print saver. Even under controlled environmental conditions, it was a re
Electronics Forum | Thu Apr 20 13:50:28 EDT 2006 | fredericksr
All, Does anyone sell a safe and effective way to connect a DMM to building ground via a power outlet? Personally, I'm comfortable using a banana plug, but the people that are going to be performing this task may vary in electrical understandin
