Electronics Forum | Mon Jun 12 09:47:18 EDT 2006 | patrickbruneel
Hi Grant, You definitely have a pre-heat problem and not a flux problem. Pallets together with the BNC connectors put a large thermal demand on your pre-heating. 3 zones would be a good investment even with leaded solder due to the high thermal dema
Electronics Forum | Thu Oct 22 01:43:43 EDT 1998 | Frank J. de Klein
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I
