Full Site - : speed print 200 pressure issues (Page 17 of 24)

Fighting solder beads

Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev

Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep

Gluing Quality Issue !!!

Electronics Forum | Tue Nov 03 11:46:52 EST 2009 | davef

Search the finee SMTnet Archives for previous posts on the topic. Here's a clip from on of those posts that may get you started. [snip] * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, availa

Fine Pitch Printing Issues

Electronics Forum | Wed May 19 16:02:32 EDT 2010 | remullis

I am currently experiencing major issues when printing fine pitch parts. Pad width is .008 Even starting with a new screen, fresh paste, etc. I see where the paste is not breaking away from the screen apts consistently and when inspecting the pads I

Volume of paste deposited with respect to board thickness

Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz

Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu

Solder paste shifted from pad

Electronics Forum | Fri Mar 16 23:38:36 EDT 2007 | mika

I don't understand so please explain in more detail. You say ~0.3mm shifted. In what direction is the paste shifted? is it shifted the very same directions on all panels? Only on this product or even with regular pcb:s? What is the size of the panel

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: Proflow of DEK screen printer

Electronics Forum | Wed Sep 08 08:25:26 EDT 1999 | Brad Kendall

Listed below are the issues Viking has been experiencing since the | installation of the Proflow Head: | 1. After installing new 350mm Wiper foil with metal | strip glued on it, It worked for about a week and suddenly meta

Re: Proflow of DEK screen printer

Electronics Forum | Tue Sep 07 15:28:13 EDT 1999 | Earl Moon

Listed below are the issues Viking has been experiencing since the installation of the Proflow Head: 1. After installing new 350mm Wiper foil with metal strip glued on it, It worked for about a week and suddenly metal stri

Re: Paste-in-Hole

Electronics Forum | Fri Apr 23 04:02:22 EDT 1999 | Scott Davies

I need to know if there are any special component pad designs that need to be considered when evaluating paste-in-hole? We have a few through hole connectors that are good candidates to place pre reflow. Does anyone have sugguestions. Thanks Chri

Gel Flex Support

Electronics Forum | Wed Nov 02 21:50:23 EST 2005 | KEN

I beta tested these 6 months before general availability. These devices worked well in some situations and mrginally in others. Migrating to Gel may depend on what your current issues are with your current tooling solutions. Generally speaking it w


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