Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2016-03-18 10:45:49.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it received two awards at the 2016 IPC APEX EXPO. MIRTEC’s MV-6 OMNI 3D AOI system was recognized with a 2016 New Product Introduction (NPI) Award in the category of Test & Inspection – AOI. Additionally, MIRTEC received the prestigious 2016 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category. Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the awards to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center.
Industry News | 2016-08-29 18:31:30.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its award-winning 3D AOI and 3D SPI systems in Booth #707 at the 2016 SMTA International Exhibition. The exhibition will take place September 27-28, 2016 at the Donald Stephens Convention Center located in Rosemont, IL.
Industry News | 2019-08-12 20:03:57.0
MIRTEC, ‘The Global Leader in Inspection Technology,’ today announced that it will display its award-winning 3D AOI, 2D AOI and SPI Inspection Systems in booth #1C55 with Mir Tech-win at the upcoming NEPCON ASIA (NEPCON SOUTH CHINA) exhibition, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2019-10-16 14:45:19.0
MIRTEC announces that the company will premier its all-new ALPHA 3D Automated Optical Inspection System at productronica 2019. New to this event, Messe München and Konradin Verlag have organized a 3D AOI Arena in Hall A2. Leading 3D AOI manufacturers such as MIRTEC will demonstrate their latest 3D Inspection Technology at this four-day event scheduled to take place Nov. 12-15, 2019, at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2014-02-17 20:17:14.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, and SPI Inspection Systems at IPC APEX 2014 booth #2263.
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.