Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Industry News | 2023-10-30 18:40:38.0
MIRTEC today announced that it is the recipient of the 2023 Mexico Technology Award in the Conformal Coating Inspection category for its revolutionary GENESYS-CC AI Based Conformal Coating AOI Series. The award was announced during a ceremony held on Wednesday, October 25, 2023 during the SMTA Guadalajara event in Mexico.
Industry News | 2023-11-20 15:14:33.0
MIRTEC announces its receipt of the prestigious 2023 GLOBAL Technology Award in the Conformal Coating Equipment category. The award was presented in recognition of MIRTEC's groundbreaking GENESYS-CC AI Based Conformal Coating AOI Series during an award ceremony held at productronica in Munich on Nov. 14, 2023.
Industry News | 2018-01-28 19:18:11.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1327 at the 2018 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place February 27th- March 1st, 2018 at the San Diego Convention Center.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2003-03-25 09:24:51.0
The Cadstar Universal package enables educational establishments to provide multiple licences of current generation PCB design solutions for students at a cost equivalent to a standard single licence.
Industry News | 2003-04-21 09:53:12.0
Michael T. O'Neill and Peter J. Simone
Industry News | 2003-05-02 08:49:07.0
Group to Assemble Data by Package and Technology Type
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-07-03 08:45:09.0
Leading Electronic Manufacturing Service Provider Leverages Tradec Solution to Manage Commodity Cost and Accelerate the Quotation Process