Industry News | 2015-06-02 19:58:49.0
SPEEDLINE TECHNOLOGIES, INC and FUJI MACHINE MFG. CO., LTD have decided to strengthen sales collaboration in Japan. Both parties have agreed on developing a strategic approach to the market in Japan, which will allow us to offer the world’s best solutions in the PCB (Printed Circuit Board) production industry.
Industry News | 2014-03-26 08:24:10.0
Speedline Technologies and Cogiscan will introduce the first product resulting from their recent collaboration. The new software based on Cogiscan TTC technology can harvest and report traceability data from Speedline printers. This product will be sold and supported by Speedline under an OEM reselling agreement with Cogiscan.
Industry News | 2004-12-14 22:16:06.0
New Partnership Agreement
Technical Library | 2008-05-28 18:41:53.0
This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.
Used SMT Equipment | Board Cleaners
Speedline Technologies Electrovert Aquastorm 200 PCB Wash/Clean Machine, s/n AS2-1106402-01 w/ Associated Controls, Manuals, Parts Hurrincae Wash Chemical Isolation Convenience package - AND MORE AUCTION ITEM: www.xlineassets.com
Used SMT Equipment | Screen Printers
Speedline Technologies MPM Accela Solder Paste Printer 2006 Vintage SN: AC02126 Closed loop dual z Squeegee Venturi vacuum underwipe Board clamping High speed inspection HW trigger Speed vision - contrast and texture Bridge vision Paste tran
Used SMT Equipment | Screen Printers
Speedline Technologies MPM UP2000/B solder paste screen printer, powered up and tested, complete and operational with manuals. FOB: MN 55441 Contact: AssuredTechnicalServiceLLC@Gmail.com
Industry News | 2002-11-20 11:23:28.0
EKRA Announces the Filing of a Patent Infringement Lawsuit Against Speedline Technologies
Technical Library | 2008-01-16 18:25:55.0
The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.
Technical Library | 2008-02-12 22:52:41.0
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems.
.png)
