New SMT Equipment: speific and heat (153)

Rework and Repair Services

Rework and Repair Services

New Equipment | Rework & Repair Services

In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur

ACI Technologies, Inc.

Hanwha DECAN S2 Pick and Place Machine

Hanwha DECAN S2 Pick and Place Machine

New Equipment | Pick & Place

Hanwha DECAN S2 Pick and Place Machine High Speed:92,000 CPH(HS10 head) PCB Size : L510xW460mm Feeder position:120ea Weight: 1,800kg  INQUIRY Hanwha DECAN S2 Pick and Place Machine Specifications: Hanwha DECAN S2 Pick and Place Machine Ha

Flason Electronic Co.,limited

Electronics Forum: speific and heat (140)

tape and reel machine

Electronics Forum | Wed Oct 10 12:22:08 EDT 2001 | Kevin

Cal, There are several suppliers of cover tape materials that do not require heat to activate the adhesive. 3M and Advantek are likely the leaders. There are relatively few T&R machines that can handle both heat and non-heat applications - as Chri

0201 and uBGA

Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef

Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?

Used SMT Equipment: speific and heat (2)

Heller Convection SMT Reflow Oven 1826 MK5 with Temperature Range of 60-350°C and 183" 465cm Length

Heller Convection SMT Reflow Oven 1826 MK5 with Temperature Range of 60-350°C and 183" 465cm Length

Used SMT Equipment | Soldering - Reflow

The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5

Shenzhen Honreal Technology Co.,Ltd

Precision Valve and Assembly IR2000

Precision Valve and Assembly IR2000

Used SMT Equipment | Coating and Encapsulation

Reconditioned PVA IR2000 Curing Oven with Himdification, 460VAC 3 phase, L to R board flow, Pin Chain conveyr, SMEMA, 4 top and 4 bottom IR heating panels.

Assured Technical Service LLC

Industry News: speific and heat (269)

HELLER Participates at the Beijing Intelligent Manufacturing and SMT Technology Exchange Conference

Industry News | 2023-06-12 21:14:11.0

The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.

Heller Industries Inc.

Multi-Functional System Dispense with Pick and Place

Industry News | 2016-11-07 16:28:47.0

GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.

GPD Global

Parts & Supplies: speific and heat (6)

Juki  nozzle 106 used in 705 pick and place machine

Juki nozzle 106 used in 705 pick and place machine

Parts & Supplies | SMT Equipment

Juki nozzle 105 for 705 smt machine Description: Brand:JUKI Color:plated gold Material:imported steel Nozzle model:101 102 103 104 105 106 Application:Juki 750 smt machine Customize:yes Nozzle advantage: 1.The nozzle main body adopts impor

KingFei SMT Tech

Juki Juki nozzle 106 used in 705 pick and place machine

Juki Juki nozzle 106 used in 705 pick and place machine

Parts & Supplies | SMT Equipment

Juki nozzle 105 for 705 smt machine Description: Brand:JUKI Color:plated gold Material:imported steel Nozzle model:101 102 103 104 105 106 Application:Juki 750 smt machine Customize:yes Nozzle advantage: 1.The nozzle main body adopts impor

KingFei SMT Tech

Technical Library: speific and heat (8)

Latent heat induced deformation of PCB substrate: Measurement and simulation

Technical Library | 2022-12-05 16:28:06.0

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.

Czech Technical University in Prague

A Case Study on Evaluating Manual and Automated Heat Sink Assembly Using FEA and Testing

Technical Library | 2016-06-23 13:24:56.0

Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.

Flex (Flextronics International)

Videos: speific and heat (16)

GPD Global: Multi-Functional System Dispense with Pick and Place

GPD Global: Multi-Functional System Dispense with Pick and Place

Videos

http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo

GPD Global

Camalot NuJet and DDH (Dual Dynamic Head)

Camalot NuJet and DDH (Dual Dynamic Head)

Videos

NuJet and DDH

ITW EAE

Training Courses: speific and heat (3)

Profiling and Solder Reflow Course

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: speific and heat (5)

Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization

Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,

Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference and Exhibition

Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference and Exhibition

Surface Mount Technology Association (SMTA)

Express Newsletter: speific and heat (217)

SMTnet Express - May 15, 2014

SMTnet Express, May 15, 2014, Subscribers: 22742, Members: Companies: 13878, Users: 36194 Performance of Light Emitting Diode on Surface Machined Heat Sink S. Shanmugan, D. Mutharasu, O. Zeng Yin, Universiti Sains Malaysia In the point

Partner Websites: speific and heat (2484)

671226 - Heat Exchange Assy, New Style Heat Exchanger

Heller Industries Inc. | https://hellerindustries.com/parts/671226/

671226 - Heat Exchange Assy, New Style Heat Exchanger Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

Accu-Heat Oven

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_strategic_products_accuheat_oven.html

. We can skid, crate, package and ship to countries overseas by boat or airplane. Price: $4,000 USD Accu-Heat II Oven See more photos below                          Home     SMT & PCB Equipment

1st Place Machinery Inc.


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