Electronics Forum | Sun Jul 26 17:13:31 EDT 2009 | slthomas
Is it possible that the assembler is using solder wire that's too small for the application and feeding it too quickly to compensate?
Electronics Forum | Mon Nov 02 22:02:01 EST 2009 | boardhouse
Umar - the boards are not assembled - so Solder splash is not applicable. Solder resist does not Melt it cures. As a board supplier I would not want my clients to adapt if they are receiving crap product, I would expect them to leave.
Electronics Forum | Fri Jan 08 16:48:21 EST 2010 | allwave
I did the same thing in ours (removed the chip wave). What kind of machine do you have? What I did on our TD machines, I added some extra channels to minize the solder "splash" on the void which is the reason more dross is formed. Hope this helps a
Electronics Forum | Thu Dec 10 22:36:03 EST 2020 | solderingpro
I represent PROMATION USA and we have several solutions for solder wire perforation: Our QUICK 372B is a stand-alone drilling station. Our QUICK 371DI is a semi-automatic hand soldering station with perforation technology. Our QUICK 300A/B is a d
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117
Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to
Electronics Forum | Tue Jun 17 09:24:43 EDT 2008 | rgduval
Could it be from a dirty stencil, rather than from the pick and place operation? We've seen a number of occurences recently with solder balls near some of our fine pitch components...we eventually diagnosed as dirty stencils...excess solder on the b
Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef
Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu
Electronics Forum | Sat Mar 11 08:53:44 EST 2017 | tch
My company is looking for a vacuum that can handle being used to clean up solder splashes on the bottom of our wave solder machines and around the solder pot area in our ERSA Selective Solder Machines. In the past we would use a Shopvac but these don
Electronics Forum | Thu Feb 13 03:54:57 EST 2020 | majdi4
we are obliged by customer specifications that there will be no glue despensing process on the production line.. also that the glue dispensing process is very complicated for this case .. we could have glue splash on top surface of pcb so that will
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