Used SMT Equipment | In-Circuit Testers
JDSU OLP-16C Optical Power Meters The Acterna OLP-15C, OLP-16C and OLP-18C are compact, high performance optical power meters for installation, maintenance and repair in fiber optic networks. They can be used on their own for simple system powe
Used SMT Equipment | In-Circuit Testers
JDSU OLP-16C Optical Power Meters The Acterna OLP-15C, OLP-16C and OLP-18C are compact, high performance optical power meters for installation, maintenance and repair in fiber optic networks. They can be used on their own for simple system powe
Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
Made from 100% nitrile, a preferred alternative to the traditional natural rubber latex fingercot. The QRP proprietary formulation of 100% nitrile is completely free of latex and latex proteins. Inherently anti-static, the 9C fingercot is ideal for u
TR7500 SIII CI brings easy Conformal Coating Inspection that combines a multi-camera optical design with specialized multi-phase lighting to inspect UV-active Conformal Coatings. Included angle view cameras ensure the TR7500 SIII CI identifies even t
Industry News | 2012-03-13 10:31:08.0
SANTA ANA, CA — March 2012 ― Industry-leading solutions provider Christopher Associates Inc. made quite the splash with both exhibitors and attendees at the IPC APEX EXPO 2012 in San Diego, CA (2/28-3/1).
New Equipment | Rework & Repair Equipment
An advanced compact station incorporating JBC technology in one self contained unit. The intelligent sleep and hibernation functions, which help extend tip life and save energy, works so well because JBC's extremely fast temperature recovery, unriv
OBSMT DIP soldering machine suitable welding the THT chips . Best suitable for small production quantity welding. Economic and save labor. E: sales@obsmt.com T:86-13926596436(wechat/whatsapp)
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
