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How to Use the Right Flux for the Selective Soldering Application

Technical Library | 2017-05-17 22:33:43.0

The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.

Kester

9C Nitrile Latex-Free Fingercots ISO 5

9C Nitrile Latex-Free Fingercots ISO 5

New Equipment |  

Made from 100% nitrile, a preferred alternative to the traditional natural rubber latex fingercot. The QRP proprietary formulation of 100% nitrile is completely free of latex and latex proteins. Inherently anti-static, the 9C fingercot is ideal for u

QRP, Inc

TR7500 SIII CI Conformal Coating Inspection Solution

Videos

TR7500 SIII CI brings easy Conformal Coating Inspection that combines a multi-camera optical design with specialized multi-phase lighting to inspect UV-active Conformal Coatings. Included angle view cameras ensure the TR7500 SIII CI identifies even t

TRI - Test Research, Inc. USA

Christopher Associates Has the Golden Ticket! Gives “Advertising Grants” at IPC APEX 2012

Industry News | 2012-03-13 10:31:08.0

SANTA ANA, CA — March 2012 ― Industry-leading solutions provider Christopher Associates Inc. made quite the splash with both exhibitors and attendees at the IPC APEX EXPO 2012 in San Diego, CA (2/28-3/1).

Christopher Associates Inc.

CD Soldering Station

CD Soldering Station

New Equipment | Rework & Repair Equipment

An advanced compact station incorporating JBC technology in one self contained unit. The intelligent sleep and hibernation functions, which help extend tip life and save energy, works so well because JBC's extremely fast temperature recovery, unriv

JBC Tools USA, Inc

high efficiency DIP soldering machine

high efficiency DIP soldering machine

Videos

OBSMT DIP soldering machine suitable welding the THT chips . Best suitable for small production quantity welding. Economic and save labor. E: sales@obsmt.com T:86-13926596436(wechat/whatsapp)

Shenzhen Oubel Technology Co.,Ltd

SHENMAO Features Laser Soldering Paste at IPC APEX 2016

Industry News | 2016-02-25 14:29:00.0

SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces Laser Soldering Paste

Industry News | 2016-05-31 20:58:06.0

SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.

Shenmao Technology Inc.

PC/104 Embedded PC Modules & Enclosures

PC/104 Embedded PC Modules & Enclosures

New Equipment |  

Commercial-off-the-shelf (COTS) PC/104 and PC/104-Plus computer cards and components, including x86 and PowerPC CPUs; DC/DC converter power supplies and interfaces; fan cards and heatsinks; digital I/O and mass storage boards; fieldbus interfaces (C

Parvus Corporation

S3088 CCI - Conformal Coating AOI

S3088 CCI - Conformal Coating AOI

New Equipment | Inspection

The Viscom S3088 CCI checks for the completeness of conformal coating on PCBs, and is intelligently linked to other inspection gates from Viscom. Reliable, precise detection of coating voids. Transparent conformal coating protects electronics assem

Viscom AG


splash searches for Companies, Equipment, Machines, Suppliers & Information

Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

High Precision Fluid Dispensers
Thermal Interface Material Dispensing

High Throughput Reflow Oven
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications
Baja Bid Auction JUL 9-10, 2024

Component Placement 101 Training Course
PCB separator

Low-cost, self-paced, online training on electronics manufacturing fundamentals