Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Wed Mar 20 16:10:27 EDT 2013 | woodsmt
Most pots have a drain system, but that is a scary thing to use. I have seen places that have plumbed it nicely with ball valves and such to control the flow into small containers, but still fraught with danger. I use small metal bread pans. I lad
Electronics Forum | Tue Apr 18 06:15:49 EDT 2006 | JH
AJ, I have had the Solder Saver on trial a couple of times and reached the same conclusion both times - it is not for us. However there are benifits for some users. In case you dont know how it works, here is a brief explanation; The hand held to
Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys
| We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit
Electronics Forum | Wed Feb 17 15:56:22 EST 1999 | Tuffty
| Dear Al, | Are these reworked, double-sided boards? | | If you attempt to clean side #2 of double-sided misprint in a "spray" type cleaner, millions of solder balls can be broadcast throughout the same chamber as the populated side #1. Or, if thi
Electronics Forum | Mon Mar 03 17:42:35 EST 2008 | tonyamenson
I stripped the entire board because I had to have the boards troubleshot. Had a high failure rate from the field. The board coating was applied about 5 months ago. I was told by my people anything past 3 days and you will need this type of stripper
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
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