Electronics Forum | Mon Dec 17 15:11:35 EST 2007 | chef
Blew chunks - thanx for thinking outside the box. Of course there's two sides to every story. Just last week I had a new operator "splash" a couple of boards. Top solder was great, it was all one big solder bridge. Come to find out, the operator forg
Electronics Forum | Thu Dec 28 13:11:37 EST 2000 | RONALD MALICK
I AM LOOKING FOR A COMPANY TO DO SOME GOLD TAB CLEAN UP -- REMOVE SOLDER SPLASH. ANY SUGGESTIONS?
Electronics Forum | Tue Nov 30 17:32:37 EST 2004 | russ
If you are lucky, you might be able to chip the solder off the fingers with an Exacto knife and then polish it up with a pink eraser. This does work if the solder on the fingers isn't wetted very well. Russ
Electronics Forum | Mon Mar 07 08:03:14 EST 2005 | jonathanpaul
Have any of you ever experienced minor eruptions in your solder bath while it is heating up? Our solder bath splashes solder while it's heating. Once the bath is molten, it no longer does. Can anyone suggest a cause?
Electronics Forum | Mon Apr 14 12:26:11 EDT 2008 | muse95
We had one guy get injured three times by solder splashes 5 years ago - so due to one klutz, our whole production floor is a safety glass zone...
Electronics Forum | Tue Jun 17 11:02:47 EDT 2008 | dwelch123
You need to adjust the air kiss. The machine blows a slight amount of air after placement and it is probably adjusted too high.
Electronics Forum | Tue Jun 17 15:00:36 EDT 2008 | duchoang
"The machine blows a slight amount of air after placement and it is probably adjusted too high. " Is that adjustable and how to do it on TopazX2 Assembleon Pick and Place Machine?. Thank you very much.
Electronics Forum | Wed Jun 18 07:48:29 EDT 2008 | gemengr
vo^ cai' tab pick vacuum% set at 30 and tab mount vacuum % set at 30 . neu^' va^n~ con` bi. thi` set lai vacuum cho nozzle #72 in machine data. by the way duyHoang o*? ddau^ zi?? good luck
Electronics Forum | Wed Apr 29 01:38:38 EDT 2009 | nibirta
already did this test. No solder balls. i have printed the pads without the component. No solder balls. Only with the component. The problem is, it splashing the around components. solder balls wew found on the body of a connector and on top of it. T
Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef
Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper
