Electronics Forum | Tue Nov 30 16:04:04 EST 2004 | fcox
When you say something went wrong in the screening process, do you mean that the paste is splashed (prior to reflow)?
Electronics Forum | Mon Jun 16 19:16:28 EDT 2008 | duchoang
I am using TopazX2, placing 0603 caps with #72 FNC nozzles. Sometimes, there is solder splash around the caps, being blowed out by the nozzle (?) when it placed the part down. Any idea about the reason and solution. Thanks.
Electronics Forum | Fri Jul 24 23:20:11 EDT 2009 | umar
Hi Dave, Thanks on your feedback, May I know the how's the contributing of Moisture content of bare board and the Thickness of the copper plating in the PTH to the solder ball and solder splash during hand soldering process ?
Electronics Forum | Tue Feb 21 16:39:03 EST 2017 | ltchsze
Thanks for input, dyoungquist. The condition here is without any flux or paste applied. Solder from component terminal started splashing by itself when put through re-flow.
Electronics Forum | Fri Dec 11 08:56:08 EST 2020 | SMTA-64304223
One of the common causes of solder ballin is also outgassing from the boards have your tested the board for outgassing? Bob Willis
Electronics Forum | Fri Dec 11 13:06:54 EST 2020 | johndep7
I haven't, that is a good idea, I was reading about the chance of that earlier but I was not sure. The best way to eliminate is to bake the board?
Electronics Forum | Tue Jan 19 10:18:58 EST 2021 | grahamcooper22
Hi, try a low spitting cored wire...something like ALMIT SR-LA cored wire...or SR-LA SUPER...it eliminates flux/solder spitting during soldering.
Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7
My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Tue Sep 30 14:16:49 EDT 2003 | davef
While your waiting for others to respond, search to fine SMTnet Archives on: "solder and gold and finger"
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