Electronics Forum | Thu Jan 31 10:20:04 EST 2013 | rjohnston58
Need your help with a referee call on solder balls. See attached pictures. Engineering believes the solder balls and splash in pictures violate IPC-A-610E-2010 section 5.2.7.1. Purchasing on the other hand believes these are acceptable. Info: balls a
Electronics Forum | Fri Jan 29 21:31:46 EST 2010 | aqueous
I would recommend the following paper entitled "Cleaning for Reliability Post QFN Rework" by Mike Bixenman (Kyzen) and myself (Aqueous Technologies). While it discussed cleaning under QFN's in a batch environment, it is also applicable to cleaning u
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt
IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur
Electronics Forum | Thu Nov 06 07:54:50 EST 2003 | davef
First, skewing is a perfectly acceptable condition, providing the amount of skewing is not excessive. A-610 provides guidance. Second, this part is a land grid device. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Fri Apr 25 13:30:45 EDT 2008 | flipit
I use Namics 8437-2 for micro BGA and flip chips. Will work for QFN or MLF after soldering. Flows well under gaps as thin as 0.001". Cure in 5-10 min at 150 C. Rock solid product. Is bit expensive. Is from Japan.
Electronics Forum | Wed Jul 03 17:23:03 EDT 2019 | davef
Pavel Murtishev: Please click the link under my avatar [to the left of this message] and send me your email address.
Electronics Forum | Sat Nov 10 22:45:06 EST 2007 | realchunks
1. What is the body size? Who cares. 2. What is the pitch? Doesn't amtter. 3. What is the terminal size? Doesn't matter 4. What is the land pattern size? Really doesn't matter. 5. The Thermal square pad in the middle, with how many vias? If you
Electronics Forum | Wed May 22 19:47:30 EDT 2013 | anvil1021
Also, I was just thinking that most of the large companies we work with do not consider via drain an actual void. As a matter of fact our high dollar super fantastic Xray system actually has a switch to turn off the vias during void detection so that
